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Manual positioner of SMD components
Manufacturer: LPKF
Model: ZEL PLACE BGA

Positioning equipment for surface mount devices (SMD), such as ball grid array (BGA), chip scale packaging (CSP), flip chip, fine-pitch and ultrafine-pitch components, from 5 mm x 5 mm to 45 mm x 45 mm. It can be adjusted for laboratories and for mass production.


The UPC offers the services performance that the equipment could carry out.

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